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TM-Firmware Engineer(Local)-Shenzhen

  • Shenzhen, China
  • Pay not stated
  • Posted on 6 Aug 2026

Key facts

Location
Shenzhen, China
Workplace
Not stated
Pay
Not stated
Contract
Not stated
Detected
3 Nov 2026
Posted
6 Aug 2026

About the role

工作职责: 1. 负责空调产品单板软硬件设计开发; 2.负责市场及生产问题的处理和解决; 3.上级主管交付的其他工作。

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